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Flip 3

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Flip 3
Flip 3
Flip 3
  • Released 2024
  • 143.5g, 19.8mm thickness
  • KaiOS 3.1
  • 16GB storage, microSDXC
  • 3.2 inches
    240 x 320 pixels
5MP
480p
1GB RAM
Snapdragon 215
1850mAh

Network

Technology GSM / HSPA / LTE
2G Bands GSM 850 / 900 / 1800 / 1900
3G Bands HSDPA 850 / 1700(AWS) / 1900 / 2100
4G Bands 2, 4, 5, 12, 13, 41, 41, 66
Speed HSPA, LTE

Launch

Announced 2024
Status Available. Released 2024

Body

Dimensions 107.2 x 59.4 x 19.8 mm (4.22 x 2.34 x 0.78 in)
Weight 143.5 g (5.04 oz)
SIM Nano-SIM

Display

Type TFT LCD

Platform

OS KaiOS 3.1
Chipset Qualcomm QM215 Snapdragon 215 (28 nm)
CPU Quad-core 1.3 GHz Cortex-A53
GPU Adreno 308

Memory

Card Slot microSDXC (dedicated slot)
Internal 16GB 1GB RAM

Sound

Loud Speaker Yes

Comms

WLAN Wi-Fi 802.11 b/g/n
Blutooth 4.2, A2DP
Positioning GPS
NFC No
Radio FM radio
USB USB Type-C

Battery

Type 1850 mAh

Features

Sensors Barometer

MISC

Colors Black
Models T435D
Disclaimer: We cannot guarantee that the information on this page is 100% correct.

FAQs

This device doesn't have an official waterproof rating.

No, this device doesn't support 5G networks in USA.

Flip 3 comes with KaiOS 3.1 out of the box.

No, this device doesn't support wireless charging.

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