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Flip

13,745 hits
Flip
Flip
Flip
  • Released 2024
  • 133g, 19.9mm thickness
  • KaiOS 3.0
  • 4GB 512MB RAM storage, microSDHC slot
  • 2.8 inches
    240 x 320 pixels
2MP
480p
512GB RAM
Snapdragon 215
1850mAh

Network

Technology GSM / HSPA / LTE
2G Bands GSM 850 / 1900
3G Bands HSDPA 850 / 1700(AWS) / 1900 - 4056W
4G Bands 2, 4, 5, 12, 25, 26, 41, 66, 71 - 4056W
Speed HSPA, LTE

Launch

Announced 2024
Status Available. Released 2024

Body

Dimensions 107.3 x 55.6 x 19.9 mm (4.22 x 2.19 x 0.78 in)
Weight 133 g (4.69 oz)
SIM Nano-SIM

Display

Type TFT LCD

Platform

OS KaiOS 3.0
Chipset Qualcomm QM215 Snapdragon 215 (28 nm)
CPU Quad-core 1.3 GHz Cortex-A53
GPU Adreno 308

Memory

Card Slot microSDHC (dedicated slot)
Internal 4GB 512MB RAM

Sound

Loud Speaker Yes

Comms

WLAN Wi-Fi 802.11 b/g/n
Blutooth 4.2, A2DP
Positioning GPS
NFC No
Radio FM radio
USB USB Type-C

Battery

Type 1850 mAh

MISC

Colors Midnight Blue, Dark Gray, Slate Gray
Models 4056W, 4056S
Disclaimer: We cannot guarantee that the information on this page is 100% correct.

FAQs

This device doesn't have an official waterproof rating.

No, this device doesn't support 5G networks in USA.

Flip comes with KaiOS 3.0 out of the box.

No, this device doesn't support wireless charging.

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